Below are details of the lead-free range available. Click on the link below for information on some of the most up to date information available on lead-free manufacturing.
First in a series of interactive CD-ROMs developed by Soldertec Global to assist engineers with the practical introduction of lead-free materials and processes. Introduced by Kay Nimmo, Technical Director, Tin Technology, the CD provides a step-by-step guide to materials, soldering steps, inspection and common defects which may be seen in manufacture. The CD also features an interactive quiz on hand, reflow and wave soldering to help assess staff's knowledge on the use of lead-free materials and the changes necessary in manufacture to meet the deadline of July 2006.
The defect guide illustrates common soldering defects associated with lead-free hand soldering and desoldering.
National Physical Laboratory interactive "Lead-Free Assembly and Soldering Cook Book 3" CD-ROM is now on two CD-ROMs to include even more international views on lead-free making a total of 20. The latest views on lead free come from the likes of Dieter Bergman-IPC, Jennie Hwang, Phil Zarrow-ITM and Bill Kenyon all from the USA giving their prospective on issues faced by the industry. This was the World's First interactive resource on lead-free soldering technology It remains the first ever produced, now its updated to version 3.
Originally produced jointly by The National Physical Laboratory and Bob Willis in 1999 to address the following aspects of the technology:
Design Rules, PCB Solderable Finishes, Component Terminations, Impact on Process Conditions, Impact on Existing Equipment, Hand Soldering, Screen Printing, Reflow Soldering, Wave Soldering, Cleaning, Rework, Visual Inspection, Joint Reliability, In Circuit Test. Whether a large OEM or a small CEM, a supplier or user, this project brings together all you ever wanted to know about Lead-Free assembly technology.
Second in a series of interactive CD-ROMs developed by Soldertec Global to assist engineers with the practical introduction of lead-free materials and processes. Introduced by Kay Nimmo, Technical Director, Tin Technology, the CD provides a step-by-step guide to solder paste materials, convection and vapour phase soldering steps, lead-free inspection and common reflow defects which may be seen in manufacture. The process stages and defects are illustrated with video clips.
The CD also features an interactive quiz on hand, reflow and wave soldering to help assess staff's knowledge on the use of lead-free materials. The third CD-ROM will be released shortly covering other aspects of lead-free alloys and the changes necessary to meet the deadline of July 2006.
This CD ROM updated in 2004 to version 2 provides a guide to all aspects of wave soldering with all the common process defects and lead-free. Each stage of the process including fluxing, pre heat, solder wave and conveyors are explained. The defect guide also includes defects specifically on printed boards and components which can cause soldering problems. At the first screen you can select the soldering process, equipment set-up, quality control, defect guide and CD ROM operation.
Selecting the process you want to view takes you to each section, here you have access to a large manual on wave soldering including change for lead-free. As an example in the fluxing section details of foam, spray, wave and dip fluxing systems are explained along with video clips and still photographs.
Also included on the CD ROM are procedures for Parts Per Million Monitoring, process control procedures and set-up methods. A spreadsheet is provided which may be used for defect monitoring using the PPM procedure.
The defect guide browser provides examples of defects rather than defect categories which makes it easy to compare process problems with the disk content. Clicking on the photograph provides a full screen view with an explanation of the possible causes. Each process stage is described in detail with suggested modification to the process for lead-free alloy introduction.
This CD-ROM provides the process or quality engineer with a source of lead-free photographs of process examples which may be used in company inspection documents or presentations. The photographs can also be used in marketing and advertising material or in technical articles. They may be simply pasted into any Word or PowerPoint document for in house company use. Photograph are provided in .tif or .jpg file format.
The lead-free photographs are either, conventional photographs, X-rays and microsections for surface mount or conventional joints as well as solder paste print, components and solder joints. There are over 350 images covering both satisfactory and reject joints and other process defect examples.
Interactive CD-ROM covering optical and X-ray inspection of solder joints. It includes an introduction to the lead-free assembly process with specific attention to BGA and area array devices. It provided a step by step guide to the procedure of inspection for optical and X-ray showing you how to do it. Inspection criteria are included for X-ray and visual criteria on different lead-free terminations and pad surfaces. The CD also includes many defect examples and causes as well as illustrating the reflow of different terminations with unique micro video clips.
CD-ROM includes - Modern Lead-Free Assembly Processes, Lead-free Alloys, BGA - Area Array Reflow, Inspection Techniques, Inspection Procedures, Optical Inspection, X-Ray Inspection, Defect Guide, Inspection Criteria.
