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 Lead-Free
 A Guide to Lead-Free Soldering
 Environment-Friendly Electronics: Lead-Free Technology  Lead-Free Soldering


A GUIDE TO LEAD-FREE SOLDERING FOR ASSEMBLERS & SUB-CONTRACTORS
An electronic book
by Roger Bilham

A new electronic book, available now as a PDF by e-mail or on CD, is the new concise source for lead-free manufacturing.

Can you answer the following questions:

  • How will the European Directive banning the use of lead in electronic and electrical equipment impact your business?

  • Have you the knowledge and information you need to meet the regulations?

  • Do you know how to go about it, when you need to be lead-free and when you need to start preparing?

  • Would you like some simple and straightforward help?
A Guide to Lead-Free Soldering for Assemblers & Contractors will help your company prepare for lead-free ensuring your company is looking forward and ready for the future of electronics manufacturing.



Figure 7.0


Topics covered in its 63 pages include:
  • Lead-free alloy requirements - technical and economic
  • Problems posed by lead-free solders
  • Melting temperatures
  • Oxidation and corrosion
  • Fillet lifting & cracking
  • Tombstoning
  • Tin Whiskers
  • Tin Pest
  • Potential and practical lead-free alloys with their properties
  • High temperature, high lead solder - component internal connections, non-melting columns and balls, module assembly
  • Patents
  • Lead-free circuit board finishes
  • Lead-free hot air solder levelling
  • Components for lead-free soldering - temperature capabilities and terminations
  • Fluxes
  • Mixed lead-free and lead-containing solders & finishes
  • Lead-free process challenges - cost, temperature, process window, machine issues, flux residues
  • Defects, inspection and quality
  • Rework and Repair
  • Solder variety and standardisation
  • Use of nitrogen
  • Lead-free in the reflow process - temperature profile, machine implications
  • Lead-free in the wave process - composition changes, machine implications
  • Lead-free vapour phase soldering
  • Environmental and cost disadvantages of lead-free solders
  • Logistics of introducing lead-free solders
  • Sources of further information
  • Legal position in Europe, USA and Japan

Price £35.00 
To have your copy sent to you today

Alternatively fill out our order form and fax it to us click hereBuy Now(Table of Contents 195Kb)

Profile
Roger Bilham is a metallurgist with many years' of experience developing and making solder products. Combining scientific awareness with commercial realism and management experience. Well grounded in metallurgy (mainly tin, lead and their alloys), with knowledge of chemistry, science in general, health and safety, quality systems, IPR and employment law.

Roger Bilham is also available for consultancy through Dynamix Technology. Please contact us for more details


© 2004 Dynamix Technology Ltd