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IPC - NEW RELEASES
 J-STD-030 - Guidelines for Selection and Application of Underfill Material for Flip Chip and Other Micropackages

 J-STD-001D - Requirements for Soldered Electrical and Electronic Assemblies - Preview

 IPC-A-610D - Acceptability of Electronic Assemblies - Preview

 IPC-1065 - Material Declaration Handbook

 IPC-1066 - Labeling of PCBs and Assemblies

 IPC-2546 Amendment 2 - Sectional Requirements for Specific Printed Circuit Board Assembly Equipment - Amendment 2; Final Assembly and Packaging

 IPC-7095A - Design and Assembly Process Implementation for BGAs - Preview

 IPC-7351 - Generic Requirements for Surface Mount Design and Land Pattern Standard

 IPC-9194 - Implementation of Statistical Process Control (SPC) Applied to Printed Board Assembly Manufacture Guideline

 IPC-2223A - Sectional Design Standard for Flexible Printed Boards - Preview

 IPC-2141A - Design Guide for High-Speed Controlled Impedance Circuit Boards - Preview (Table of Contents 21Kb)

 IPC-2251 - Design Guide for the Packaging of High Speed Electronic Circuits - Preview (Table of Contents 36Kb)

 IPC-6013A - Qualification and Performance Specification for Flexible Printed Boards - Preview

 IPC-7912A - End-Item DPMO for Printed Circuit Board Assemblies - Preview

 IPC-9702 - Monotonic Bend Characterisation of Board-Level Interconnnects - Preview (Table of Contents 21Kb)

 IPC-CM-770E - Component Mounting Guidelines for Printed Boards - Preview

 IPC-D-326A - Information Requirements for Manufacturing Printed Circuit Boards and Other Electronic Assemblies - Preview (Table of Contents 19Kb)

 IPC-DVD-65C - DVD: Fiber Optic Cable Assembly with Training Certification - Preview

 IPC-DVD-66C - DVD: The Seven Sins of Safety in Electronics Assembly with Training Certification - Preview

 IPC-DVD-PTH-CK - DVD: Through Hole Solder Joint Workmanship Standards with Training Certification - Kit - Preview

 IPC-DVD-SMTC-K - DVD: Surface Mount Solder Joint Workmanship Standards with Training Certification - Preview

 EWS-610(1) - Electronic Workmanship Standards for Surface Mount and Through-Hole Solder Joints - Preview

 J-STD-004A - Requirements for Soldering Fluxes - Preview

 J-STD-020C - IPC/JEDEC Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Device - Preview

 IPC-T-50G - Terms and Definitions for Interconnecting and Packaging Electronic Circuits - Preview

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