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IPC standards, the results of industry consensus and collaboration, are respected throughout the whole world.

Using IPC standards allows manufacturers, customers and suppliers to speak the same language.

Their wide acceptance, and your company's incorporation of the standards into your manufacturing processes, can help grow your business, adding new customers while satisfying your current customer base.

Knowing the qualification and performance specifications of PWB's can ensure that the highest quality is met and therefore reliability. IPC-A-600 (Preview Table of Contents 42Kb), Acceptability of Printed Boards, covers acceptable and rejectable conditions for printed wiring boards. It is, along with IPC-A-610 and J-STD-001, one of IPC's most widely used documents
The IPC-6010 Series covers all areas of qualification and performance of printed boards, rigid/flexible printed boards, organic multichip module mounting and interconnecting structures and HDI layers or boards. Preview IPC-6012 (Preview Table of Contents 30Kb)

Other documents available in this area include IPC-TR-470 Thermal Characteristics of Multilayer Interconnection Boards, IPC-TR-551 Quality Assessment of Printed Boards Used for Mounting and Interconnecting Electronic Components and IPC-ML-960 Qualification and Performance Specification for Mass Lamination Panels for Multilayer Printed Boards.

This sections covers specifications and guidelines in relation to drilling, numerical control formatting, molded interconnection devices & contacts and board dimensions & tolerances. It also looks at the assessments of multilayer boards.

IPC-2615 (Preview Table of Contents 27Kb) Printed Board Dimensions and Tolerances replaces IPC-D-300G. It is an invaluable companion to the PWB designer and works in sync with IPC-2221.

 Flexible Circuits
As flexible technology develops so does the need for industry standards and specifications. With the complexity that surrounds flexible printed boards IPC-6013A (Preview Table of Contents 30Kb) provides all the qualification and specification requirements that you need.

Guidelines also available for flexible printed boards include IPC-4202 (Preview Table of Contents 198Kb), Flexible Base Dielectrics for Use in Flexible Printed Circuitry, IPC-4203 (Preview Table of Contents 23Kb), Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Circuitry and IPC-4204 (Preview Table of Contents 23Kb), Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry

IPC-M-102 is a compendium of 13 standards and specifications that offer the complete guide to performance, qualification, design, coatings, assembly and acceptability of all areas of flex technology.

All standards available in IPC-M-102 are available separately.

Circuit Board Areas covered here include packaging, troubleshooting, qualification profiles, documentation requirements and assessments on cleanrooms.
IPC-PE-740A (Preview Table of Contents 404Kb) Troubleshooting Guide for Printed Board Manufacture and Assembly. This document gives case histories of problems and how they've been solved. It covers all areas of the assembly process.
IPC-T-50G (Preview Table of Contents 22Kb) Terms and Definitions for Interconnecting and Packaging Electronic Circuits provides descriptions and illustrations to help users and their customers speak the same language.

 High Density Interconnect
IPC/JPCA-4104 (Preview Table of Contents 69Kb) covers the Specification Requirements for HDI and Microvia materials. It focuses on conductive and dialectic materials that can be used for fabrication. It includes qualification and conformance requirements.

IPC-6016 (Preview Table of Contents 46Kb) is more specific to HDI layers or boards. It establishes requirements for organic HDI layers microvia technology. It looks at the acceptance criteria that reflect on end-use applications.

IPC-DD-135 is specific to testing dielectric materials for multichip modules.

 High Speed/High Frequency
Demands for faster and more reliable technology are increasing all the time. IPC-D-317 (Preview Table of Contents 91Kb) provides guidelines for the design of high speed circuitry. Topics include mechanical and electrical considerations and performance testing. This is supported by IPC-2141 Controlled Impedance Circuit Boards and High Speed Logic Design which is aimed at designers, packaging engineers, fabricators and procurement personnel to create a common understanding of each area.

Other standards that related to design include IPC-D-316 (Preview Table of Contents 68Kb) Design Guide for Microwave Circuit Boards Utilising Soft Substrates.

IPC-6018 (Preview Table of Contents 130Kb) Microwave End Product Board Inspection and Test covers the test requirements for HF boards for microstrip, stripline and multilayer stripline applications.

This looks at the requirements and test results for metallic materials in PWB's.

IPC-CF-152 Composite Metallic Material Specification for Printed Wiring Boards is our best selling product in this area. It covers the requirements various compositions including CIC, CMC and tree-layer composites.

Other documents include IPC-CF-148 Resin Coated Metal for Printed Boards and IPC-MF-150 Metal Foil for PWB's. Two documents that focus on strength test results are IPC-TR-484 Results of IPC Copper Foil Ductility Round Robin Study and IPC-TR-485 Results of Copper Foil Rupture Strength Test Round Robin Study.

This section provides quality information on recommended, tested and the inspection of laminates and raw materials.

IPC-4101 (Preview Table of Contents 123Kb) Specification for Base Materials for Rigid and Multilayer Printed Boards and covers requirements for laminate of prepreg. IPC-MI-660 Incoming Inspection of Raw Materials Manual which gives advice on industry approved test methods for inspection and evaluation of raw materials.

IPC-TR-483 Dimensional Stability Testing of Thin Laminates which provides results to the extensive testing which included a thermal stress cycle. IPC-TA-720 Technology Assessment Handbook on Laminates includes 39 of the best articles that are aimed at all types of lamination.

IPC-M-107 contains all the requirements for the various reinforcements and foils, laminates, prepreg and the HDI materials that can be added to the final product. More specific guidelines are available on subjects such as bare dielectrics, plastic substrates, adhesives and metal-clad dielectrics.

The strength of your circuit board can determine how reliable it is. IPC have constructed various manuals that focus on different materials for different applications.

IPC-CC-110 focuses on the configuration and style of the construction of fibre glass where as IPC-EG-140 ('E' glass), IPC-SG-141 ('S' glass) and IPC-A-142 (aramid glass) aim more at the actual material and how that effects the finished PWB.

Other standards are more specific to other types of material than fibre glass. IPC-QF-143 is aimed at quartz and IPC-4110, IPC-4130 and IPC-4411 look at nonwoven materials such as cellulosic fibres.

Reliability should be the major concern during any part of the design and manufacturing of PWB's. Using existing reliable testing and inspecting methods is essential. This section gives detailed analysis of proven techniques and results.

IPC-TM-650 is a comprehensive guide to all test methods and procedures for chemical, mechanical, electrical and environmental tests on all boards and connectors.

More specific documents for areas such as statistical process control (IPC-PC-90) unpopulated PWB's (IPC-ET-652), ISO9000 Quality systems (IPC-QS-95) are all available.

2004 Dynamix Technology Ltd