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ELECTRONICS MANUFACTURING BOOKSHOP
Microelectronics
Listed alphabetically by author

 Materials for Electronic Packaging
Book cover
Deborah Chung
Butterworth Heinemann
1995
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Dynamix Technology comment:
Examines the interconnections, encapsulations, substrates, heat sinks etc involved in integrated circuits.

 Wire Bonding in Microelectronics: Materials, Processes, Reliability, and Yield

George Harman
McGraw-Hill
August 1997
300 pages
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Dynamix Technology comment:
An essential! The wire bonding bible. Focusing on wire bonding in microelectronics, this edition covers new materials and techniques such as fine pitch SMT.

 Flip Chip Technologies
Book cover
John Lau
McGraw Hill
December 1995
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Dynamix Technology comment:
Again, Lau writes an excellent reference. Features authoritative contributions from the world's leading experts.

 Fundamentals of Microsystems Packaging
Book cover
Rao Tummala
May 2001
923 pages
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Dynamix Technology comment:
It has been over ten years since the first microelectronics packaging handbook from the pen of Rao Tummala was released and it still has a vast amount of very useful and relevant information. In 1997 the single book became three volumes or available as an interactive CD-ROM and remains in this reviewer's top ten reference books.

Now Rao has produced Fundamentals of Microsystems Packaging with McGraw Hill which is aimed at new engineers and students alike, but is also aimed at a level to cater for a wider audience. It should prove ideal for students at Georgia Tech where Rao Tummala is now a Professor at the Institute.

The text covers each aspect of modern electronic assembly including materials, design, reliability, interconnection methods, wafer level packaging, optoelectronics and electrical test all packed into 923 pages. Chapter one starts with an overview on microsystems and the development of systems and their future. It features a section on who invented microsystems, in chronological order. I feel there may be disagreements on the order of companies credited but this is fascinating as an overview.

Printed boards are fundamental building blocks for products and many of the advances in board manufacture are a key to success of microsystems. The basic construction of boards is covered together with the advances in via technology and material construction. Each chapter in this book ends with a homework section of specific questions. Out of the 18 questions this reviewer had to look back through the chapter to answer two questions correctly. - Bob Willis

 Microelectronics Packaging Handbook

Rao Tummala, Eugene Rymaszewski & Alan Klopfenstein
Chapman & Hall
November 1997
3000 pages
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Dynamix Technology comment:
A three-volume set updating the authors' earlier one-volume "Microelectronics Handbook" published in 1988. Revised to incorporate advances in the industry, this text provides a balance of theory and practical applications. The set explains the latest in microelectronics design methods, modelling tools, simulation techniques and manufacturing procedures.


2004 Dynamix Technology Ltd