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 Microvias for Low Cost High Density Interconnect

John Lau & Ricky Lee
McGraw Hill Professional
June 2001
560 Pages
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Dynamix Technology comment:
Lau and Ricky Lee have just produced another timely text book for the industry, which will undoubtedly be well received by design and fabrication engineers alike. The use of microvias of different styles has been growing in the industry for the last few years with many new techniques being used to fabricate ever smaller connections. The team behind the relatively new Professional Engineering Series from McGraw Hill should be congratulated on yet another strong title.

The new text is not exclusively for the PCB fabrication engineer as its title may suggest it covers via technology for board and component level interconnection. Increasingly Ball Grid Array and Chip Scale Packages use microvias to make interconnection between PCB and silicon possible. After all the BGA substrate is just a small thin PCB, but with very fine feature sizes ultimately a necessity. The first chapter sets the scene in the industry with trends and the ever decreasing feature sizes demanded by professional consumer products.

Ricky Lee and John Lau in chapter 3 cover manufacturing, design and reliability aspects of each of the major via types including drilled, laser ablation and photo vias. The text also provides good coverage of the basic printed board fabrication process and where changes may be necessary for different via manufacturing techniques. Of particular interest is the changes in base substrates necessary with laser vias.

As with many other text books to day there is also a chapter relating to alternative solders in this case titled "Solders for the Next Generation". The main issues for engineers is alternatives to lead based alloys and this is covered both from a solder alloy prospective and the effect on area array packages like BGA and WLCSP Wafer Level Chip Scale Package.

Chapter 11 covers the assembly process for Flip Chip and CSP onto the based substrate and features a number of issues relating to underfill. It illustrates some of the mechanical and electrical faults that occur after environmental testing. It also illustrates visual defects and those that can only be found during x-ray or C Scan.

This is a good strong reference book, well illustrated with line drawings, micrographs and product examples and nothing less that I would expect from John Lau. - Bob Willis

 Six Sigma for Electronics Design and Manufacturing

Sammy G Shina
McGraw Hill Professional
May 2002
364 Pages
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Dynamix Technology comment:
This powerful engineering resource provides the detailed methodologies, illustrations, and calculations needed for the implementation and improved utilisation of Six Sigma in the electronics, mechanical, aerospace, and medical industries.

Written by an acknowledged Six Sigma quality expert with a flair for clear, succinct writing, and priceless hands-on new product development and manufacturing experience, Six Sigma for Electronics Design and Manufacturing includes eye-opening real-world electronics and high-technology industry case studies and covers essential issues such as:

  • Six Sigma connectivity with world-class quality tools
  • Achieving Six Sigma using the manufacturing control systems
  • Six Sigma methodology in the design of new systems and products
  • Using Six Sigma for product cost estimation and test strategy
  • How to use Six Sigma in high- and low-volume products and lifecycles
  • Six Sigma in project management, including the supply chain
  • Using Design of Experiments (DoE) to achieve Six Sigma goals
  • Successful Six Sigma roadmaps
  • ....and more!

     Design Guidelines For Surface Mount & Fine Pitch Technology
    Vern Solberg
    McGraw Hill
    November 1995
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    Dynamix Technology comment:
    An essential! You have got to have the design right if you want economical and trouble-free processing!

    2005 Dynamix Technology Ltd