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ELECTRONICS MANUFACTURING BOOKSHOP
PCB Assembly
Listed alphabetically by author

 Surface-Mount Technology for PC Boards
Book cover
James Holloman
PROMPT Publications
July 1995
509 pages
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Dynamix Technology comment:
This book is intended for the working engineer or manager, the student or the interested layman, who would like to learn to deal effectively with the many trade-offs required to produce high manufacturing yields, low test costs, & manufacturable designs using SMT. The information presented in this book includes the benefits & limitations of SMT, SMT & FPT components, manufacturing methods, reliability & quality assurance, & practical applications.

 Modern Solder Technology for Competitive Electronics Manufacturing
Book Cover
Jennie Hwang
McGraw Hill
April 1996
560 pages
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Dynamix Technology comment:
This text provides coverage of all relevant technologies related to the applications of solder, covering the fundamental principles involved in each process, but also relating those principles to the execution of practical applications. It also provides the working solder knowledge needed to implement an electronic manufacturing system using any of the new technologies available.

 Area Array Packaging Handbook: Manufacturing and Assembly
Book Cover
Ken Gilleo
McGraw Hill
ISBN: 0071374930
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Dynamix Technology comment:
Area array packaging, comprising the use of ball grid array (BGA), chip scale package (CSP) and flip chip (FC) technologies, is the fastest growing segment of the electronics packaging and manufacturing market. It is being driven by the increased need for high density interconnects (HDI) for portable communications devices like laptops, cell phones, palm tops and micro-browsers. Packaging is the bottleneck in creating these micro-devices, and area array packaging, creating packages 20 times smaller than those of traditional packaging, is the solution. BGAs, FCs and CSPs have become an irreplaceable part of the current generation pagers and cell phones, but these devices are shrinking even as more features are being added to them.

This book describes in detail all approaches: design, packaging, construction, assembly and application. The handbook deals with the pros and cons of using each technology with varying application; deal in detail with the difficult packaging ramifications of HDI design concepts; and focus on critical reliability and testing issues.

 Soldering in Electronics Assembly
Book cover
Mike Judd & Keith Brindley
Butterworth Heinemann
Second edition
January 1999
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Dynamix Technology comment:
"This excellent book clearly explains soldering processes, solder, flux, cleaning and quality control, as they apply to printed circuit board assembly. It deserves a place on the desk or bench of everyone involved in the practical business or modern machine soldering in electronics." - ITRI Journal

 Ball Grid Array Technology

John Lau
McGraw Hill
January 1995
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Dynamix Technology comment:
An essential! Probably the best of the recent books on this new technology. This book is a one-stop guide to state-of-the-art BGA technology.

 Chip Scale Package
Book Cover
John Lau and Ricky Lee
McGraw Hill
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Dynamix Technology comment:
Covers the different options of CSP broken down into sections covering design, materials, fabrication, reliability and advantages of the different CSP styles. Worth reading to be ready for the next development in manufacture.

 Reflow Soldering Processes and Troubleshooting SMT, BGA, CSP and Flip Chip Technologies
Book Cover
Ning-Cheng Lee

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Dynamix Technology comment:
This book provides an overview of solder materials, SMT technologies, solder bumping, flip chip assembly and several other related topics. The author also provides extensive information on the processes involved in the various technologies.

Within other books "there might be historical information and comparisons of technology, but if you need to know whether to try more of material A or less of it if your process is giving you particular defect, then you are out of luck. In Lee's book, I seen plenty of clear graphs showing, for example, the relationship between voiding and flux viscosity for a particular material set" said Jefferey C Demmin.

In addition "Most important, for me anyway, there are many cross-section diagrams and SEM images. It's hard to beat those for transmitting technical information.

"In fact, it even contained some company developments that I hadn't even heard of yet - and I get paid to know these things!" - Jeffrey C Demmin commented.

 The Aqueous Cleaning Handbook

Malcolm McLaughlin and Alan Zisman
July 1995
122 pages
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Dynamix Technology comment:
An interesting read that provides a detailed analysis on the process of cleaning and provides an explanation as to why the industry moved from solvents to aqueous and semi-aqueous cleaning

 Surface Mount Technology: Principles and Practice, 2nd Edition
Book cover
Ray Prasad
Kluwer Academic Publications
Second Edition
March 1997
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Dynamix Technology comment:
This standard work of reference continues to focus on educating electronic engineers in surface mount principles, mainstream industry practices and technology options.

Everything you have come to expect from the first edition plus much more is presented in this one-of-a-kind resource, exploring the basic principles and practice of SMT technology. Practising engineers, managers, technicians and purchasing agents involved in the manufacturing and outsourcing of electronic assemblies will find this book to be very useful in solving day to day design and manufacturing problems.

In addition, professors and students of electrical, mechanical, manufacturing, materials and packaging engineering will find this to be an indispensible text.

 Handbook of Lead-Free Solder Technology: For Microelectronic Assemblies (Engineering Handbooks)

Karl J. Puttlitz & Kathleen A. Stalter
Higher Publications
January 2003
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Dynamix Technology comment:
The toxic effects of lead are well known. The presence of dangerous lead levels in consumer electronic products like laptops and desktop computers, cell phones, palm pilots and cameras has been less publicised. Lead in electronics is now banned in Europe and Japan and market forces have created a de facto ban in North America.

A ban on lead has severe consequences for microelectronics: lead replacements will have higher melting points and the higher temperatures required for packaging and manufacturing processes will affect printed circuit board finishes and materials, fluxes and the entire soldering process.

Written by a global team of experts from key companies around the world (IBM, Cookson, Nokia), this book provides a tutorial and reference for electronics manufacturers currently beginning or already undergoing the lead-free conversion process, dealing with each effect the lead ban will have on microelectronics packaging and manufacturing. Spearheaded by IBM's industry-leading Corporate Lead Reduction operation, the book presents a complete technology programme for dealing with the necessitated switch to lead-free solders. It deals with both technology and market issues.

 SMT Soldering Handbook

Rudolf Strauss
Butterworth Heinemann
Second edition
May 1998
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Dynamix Technology comment:
A comprehensive guide to the methods of soldering components to their substrates. Dr Strauss was the "inventor" of wave soldering. Also covers placement, cleaning, quality control and rework. New sections on BGA, lead-free, no-clean fluxes and standards and specifications.

"This is a book well worth having on one's shelf in these days of rapid changes and economic stringency." - Dr Wallace Rubin

"There are few persons more qualified than he to write a book on this subject. I would very strongly recommend it on the bookshelf of every production engineer or manager involved with soldering surface mount devices. It is very good value for money and very informative." - Brian Ellis



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