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ELECTRONICS MANUFACTURING BOOKSHOP
PCB Assembly
Listed alphabetically by author
| Area Array Packaging Handbook: Manufacturing and Assembly |
Ken Gilleo
McGraw Hill
ISBN: 0071374930
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Dynamix Technology comment:
Area array packaging, comprising the use of ball grid array (BGA), chip scale package (CSP) and flip chip (FC) technologies, is the fastest growing segment of the electronics packaging and manufacturing market. It is being driven by the increased need for high density interconnects (HDI) for portable communications devices like laptops, cell phones, palm tops and micro-browsers. Packaging is the bottleneck in creating these micro-devices, and area array packaging, creating packages 20 times smaller than those of traditional packaging, is the solution. BGAs, FCs and CSPs have become an irreplaceable part of the current generation pagers and cell phones, but these devices are shrinking even as more features are being added to them.
This book describes in detail all approaches: design, packaging, construction, assembly and application. The handbook deals with the pros and cons of using each technology with varying application; deal in detail with the difficult packaging ramifications of HDI design concepts; and focus on critical reliability and testing issues. |
| Reflow Soldering Processes and Troubleshooting SMT, BGA, CSP and Flip Chip Technologies |
Ning-Cheng Lee
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Dynamix Technology comment:
This book provides an overview of solder materials, SMT technologies, solder bumping, flip chip assembly and several other related topics. The author also provides extensive information on the processes involved in the various technologies.
Within other books "there might be historical information and comparisons of technology, but if you need to know whether to try more of material A or less of it if your process is giving you particular defect, then you are out of luck. In Lee's book, I seen plenty of clear graphs showing, for example, the relationship between voiding and flux viscosity for a particular material set" said Jefferey C Demmin.
In addition "Most important, for me anyway, there are many cross-section diagrams and SEM images. It's hard to beat those for transmitting technical information.
"In fact, it even contained some company developments that I hadn't even heard of yet - and I get paid to know these things!" - Jeffrey C Demmin commented.
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| The Aqueous Cleaning Handbook |
Malcolm McLaughlin and Alan Zisman
July 1995
122 pages
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Dynamix Technology comment:
An interesting read that provides a detailed analysis on the process of cleaning and provides an explanation as to why the industry moved from solvents to aqueous and semi-aqueous cleaning
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| SMT Soldering Handbook |
Rudolf Strauss
Butterworth Heinemann
Second edition
May 1998 |
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Dynamix Technology comment:
A comprehensive guide to the
methods of soldering components to their substrates. Dr Strauss was the "inventor" of wave soldering. Also covers placement, cleaning, quality control and rework. New sections on BGA, lead-free, no-clean fluxes and standards and specifications.
"This is a book well worth having on one's shelf in these days of rapid changes and economic
stringency." - Dr Wallace Rubin
"There are few persons more qualified than he to write a book on this subject. I would very strongly
recommend it on the bookshelf of every production engineer or manager involved with soldering
surface mount devices. It is very good value for money and very informative." - Brian Ellis |
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©2004 Dynamix Technology Ltd
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